A peeling method of an electronic member

Japanese Patent JP6118404

B2

Provided is a method of peeling an electronic member (16) from a laminate (10) composed of the electronic member (16) adhered to a supporting substrate (12) via an adhesive film (14), the adhesive film (14) having a self-peeling adhesive layer (17) on a surface located on the side of the supporting substrate (12) and an exposed region A in at least one part of a surface (14a) which is located on the side of the electronic member (16). The method includes: a step of reducing adhesive strength between the supporting substrate (12) and the self-peeling adhesive layer (17) in the region A by applying energy on the region A; a step of removing the supporting substrate (a) from the laminate by further applying energy on the region and thus further reducing the adhesive strength reduced in the prior step between the supporting substrate (a) and the self-peeling adhesive layer from a starting point of the interface between the supporting substrate (a) and the self-peeling adhesive layer; and a step of peeling the electronic member (16) from the laminate by removing the adhesive film (14) from the electronic member (16).

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Shinichi Usugi
Koji Igarashi
Tetsumitsu Morimoto

JP2015519820A

April 19, 2017

May 22, 2014

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Mitsui Chemicals Tohcello Co., Ltd.

H01L21/683; H01L21/304

JP2003338474A
JP2004253482A
JP3438369B2
JP2010283098A
JP2003338477A
JP2013503366A
JP4704828B2
JP8031778A
JP2010098072A

WO2006013616A1
WO2009142078A1

Shinji Hayami

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