感光性樹脂組成物、感光性樹脂組成物が塗工されたドライフィルム及び感光性樹脂組成物の光硬化膜を有するプリント配線板

Japanese Patent JP6596550

B2

To provide: a photosensitive resin composition capable of obtaining a cured coating film having a superior line shape for preventing undercut and excellent elongation characteristics without impairing basic characteristics such as dry-to-touch property; a dry film coated with the photosensitive resin composition; and a printed wiring board having a photocured film of the photosensitive resin composition.SOLUTION: There is provided a photosensitive resin composition which comprises (A) a carboxyl group-containing photosensitive resin obtained by adding e) a polybasic acid and/or a polybasic acid anhydride to an unsaturated carboxylated epoxy resin which is a reaction product of a) an epoxy resin having two or more epoxy groups in one molecule, b) at least one saturated monocarboxylic acid having 5 to 17 carbon atoms, c) a dicarboxylic acid and d) an ethylenically unsaturated group-containing carboxylic acid and (B) a photopolymerization initiator.SELECTED DRAWING: None

JP6095104	An active energy-rays hardening type resin composition, a coloring spacer for display elements, and a black matrix
WO/2020/262691	ON-PRESS DEVELOPMENT TYPE LITHOGRAPHIC PRINTING ORIGINAL PLATE, METHOD FOR PRODUCING LITHOGRAPHIC PRINTING PLATE, AND LITHOGRAPHIC PRINTING METHOD
JP3406543	PHOTOSENSITIVE ELEMENT, PRODUCTION OF RESIST PATTERN USING SAME, PRODUCTION OF PRINTED CIRCUIT BOARD AND PRODUCTION OF LEAD FRAME

Okamoto Yoshio
Kiyono Momoko
Atsushi Hori

JP2018164997A

October 23, 2019

September 04, 2018

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TAMURA CORPORATION OF CHINA LIMITED

G03F7/027; C08F290/06; C08F290/14; C08F299/06; C08G59/20; G03F7/004; H05K3/28

JP2010195861A
JP2008063572A
JP2014052599A
JP2017107182A

US20130048357
KR1020120044371A

Einzel Felix-Reinhard
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima
Shuichi Sumiyoshi

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