Title:
The resin composition for polyolefin system resin foam, polyolefin system resin foam, a foaming object manufacturing method, and foaming seal material
Document Type and Number:
Japanese Patent JP5914141
Kind Code:
B2
Abstract:
The present invention relates to a resin composition for a polyolefin resin foam, including: a polyolefin (A) having a melt flow rate (MFR) at a temperature of 230° C. of 0.2 to 0.7 g/10 min and a melt tension at break measured at a temperature of 190° C. of 30 cN or more; and a polyolefin (B) having a melt flow rate (MFR) at a temperature of 230° C. of 1.5 to 10 g/10 min and a melt tension at break measured at a temperature of 190° C. of 10 cN or more, in which the polyolefin (B) is contained in an amount of from 15 to 75 parts by weight based on 100 parts by weight of the polyolefin (A).
Inventors:
Naomi Shintoku
Hatanaka
Tetsuro Kobayashi
Hatanaka
Tetsuro Kobayashi
Application Number:
JP2012103118A
Publication Date:
May 11, 2016
Filing Date:
April 27, 2012
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
C08J9/12
Domestic Patent References:
| JP2008274155A | ||||
| JP2004083804A | ||||
| JP2008088283A | ||||
| JP2010270228A |
Foreign References:
| WO2007066584A1 |
Attorney, Agent or Firm:
Yukihisa Goto