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Title:
RESIN COMPOSITION, PREPREG, METAL FOIL CLAD LAMINATE, RESIN SHEET AND PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2017088745
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition to be cured to form a cured product that may realize a printed wiring board excellent in the plating peel strength, glass transformation temperature, bending strength, thermal expansion coefficient and thermal conductivity.SOLUTION: The resin composition contains an epoxy resin (A) represented by general formula (1) and a maleimide compound (B).SELECTED DRAWING: None

Inventors:
TAKANO KENTARO
KOBAYASHI TAKASHI
Application Number:
JP2015221244A
Publication Date:
May 25, 2017
Filing Date:
November 11, 2015
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO
International Classes:
C08G59/24; B32B5/28; B32B7/02; B32B15/08; B32B27/04; B32B27/20; B32B27/38; C08J5/24; H05K1/03
Domestic Patent References:
JP2015147849A2015-08-20
JP2003500509A2003-01-07
JP2015086343A2015-05-07
JP2014194013A2014-10-09
JP2009019171A2009-01-29
Foreign References:
WO2011125778A12011-10-13
WO2014196501A12014-12-11
WO2012165423A12012-12-06
CN104877134A2015-09-02
CN104861652A2015-08-26



 
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