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Title:
PEELING DEVICE AND PEELING METHOD
Document Type and Number:
Japanese Patent JP2018050369
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a peeling device and a peeling method for suppressing a part of a wire material from which an insulating coating film on two surfaces of the wire material is peeled off by a peeling blade from being deviated from an axis center of the part of the wire material.SOLUTION: A peeling device 1 is so configured that a first peeling mold and a second peeling mold respectively have a pair of cutting blades 251 which are moved in a direction orthogonal to an axial direction of a wire material 2 and are peeled off by cutting an insulating coating and a support die 253 for supporting a side surface of the wire material 2 from a downstream side in the moving direction of the cutting blades 251 during cutting by the cutting blades 251. The supporting die 253 of the first peeling die has a convex portion 2533 protruding toward the wire material 2.SELECTED DRAWING: Figure 6

Inventors:
MIYASHITA KEITA
SHIGEMATSU HIDEKI
SAITO MASASHI
SAKAMOTO RYUZO
MIYAJIMA HIROYUKI
KOMAMURA AKIO
Application Number:
JP2016183110A
Publication Date:
March 29, 2018
Filing Date:
September 20, 2016
Export Citation:
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Assignee:
HONDA MOTOR CO LTD
SHINKO ELECTRIC IND CO
International Classes:
H02K15/04
Domestic Patent References:
JP5681248B12015-03-04
JP2007082301A2007-03-29
JP2013165579A2013-08-22
JP2011234447A2011-11-17
JP2013211939A2013-10-10
JP2016021806A2016-02-04
JP2002209319A2002-07-26
JP2017131023A2017-07-27
JP2013027192A2013-02-04
JPH07201433A1995-08-04
Attorney, Agent or Firm:
Masayuki Masabayashi
Hayashi Ichiyoshi
Hiroaki Hoshino