Title:
PEELING DEVICE AND PEELING METHOD
Document Type and Number:
Japanese Patent JP2018050369
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a peeling device and a peeling method for suppressing a part of a wire material from which an insulating coating film on two surfaces of the wire material is peeled off by a peeling blade from being deviated from an axis center of the part of the wire material.SOLUTION: A peeling device 1 is so configured that a first peeling mold and a second peeling mold respectively have a pair of cutting blades 251 which are moved in a direction orthogonal to an axial direction of a wire material 2 and are peeled off by cutting an insulating coating and a support die 253 for supporting a side surface of the wire material 2 from a downstream side in the moving direction of the cutting blades 251 during cutting by the cutting blades 251. The supporting die 253 of the first peeling die has a convex portion 2533 protruding toward the wire material 2.SELECTED DRAWING: Figure 6
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Inventors:
MIYASHITA KEITA
SHIGEMATSU HIDEKI
SAITO MASASHI
SAKAMOTO RYUZO
MIYAJIMA HIROYUKI
KOMAMURA AKIO
SHIGEMATSU HIDEKI
SAITO MASASHI
SAKAMOTO RYUZO
MIYAJIMA HIROYUKI
KOMAMURA AKIO
Application Number:
JP2016183110A
Publication Date:
March 29, 2018
Filing Date:
September 20, 2016
Export Citation:
Assignee:
HONDA MOTOR CO LTD
SHINKO ELECTRIC IND CO
SHINKO ELECTRIC IND CO
International Classes:
H02K15/04
Domestic Patent References:
JP5681248B1 | 2015-03-04 | |||
JP2007082301A | 2007-03-29 | |||
JP2013165579A | 2013-08-22 | |||
JP2011234447A | 2011-11-17 | |||
JP2013211939A | 2013-10-10 | |||
JP2016021806A | 2016-02-04 | |||
JP2002209319A | 2002-07-26 | |||
JP2017131023A | 2017-07-27 | |||
JP2013027192A | 2013-02-04 | |||
JPH07201433A | 1995-08-04 |
Attorney, Agent or Firm:
Masayuki Masabayashi
Hayashi Ichiyoshi
Hiroaki Hoshino
Hayashi Ichiyoshi
Hiroaki Hoshino
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