Title:
A substrate conveying method in a device for component mounting, and a device for component mounting
Document Type and Number:
Japanese Patent JP5990783
Kind Code:
B2
Inventors:
Eguchi Hisaaki
Shuzo Yagi
Madoaki Mawatari
Toshihiko Eiji
Shuzo Yagi
Madoaki Mawatari
Toshihiko Eiji
Application Number:
JP2013144249A
Publication Date:
September 14, 2016
Filing Date:
July 10, 2013
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
H05K13/02; H05K13/04
Domestic Patent References:
| JP2010087136A | ||||
| JP2004104075A | ||||
| JP2012054278A | ||||
| JP2011199048A |
Attorney, Agent or Firm:
Kenji Kamada
Hiroo Maeda
Hiroo Maeda