A substrate washing method, a substrate cleaning device, and a vacuum processor

Title:

A substrate washing method, a substrate cleaning device, and a vacuum processor

Document Type and Number:

Japanese Patent JP5984424

Kind Code:

B2

More Like This:

JP2015218287	ADHESIVE FILM-INTEGRATED SURFACE PROTECTION TAPE FOR USE IN GRINDING THIN FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP
JP2009220269	SLURRY FOR WIRE SAW
JP2023089007	COMPOSITION FOR POLISHING PAD, AND POLISHING PAD

Inventors:

Jiro Matsuo
Toshio Seki
Aoki Satoshi
Kazuya Dobashi
Kensuke Inouchi
Misako Saito

Application Number:

JP2012040647A

Publication Date:

September 06, 2016

Filing Date:

February 27, 2012

Export Citation:

Assignee:

国立大学法人京都大学
東京エレクトロン株式会社

International Classes:

H01L21/304

Domestic Patent References:

Foreign References:

US20110174770

Attorney, Agent or Firm:

Toshio Inoue

Previous Patent: Wiper device

Next Patent: JPS5984425