Title:
A thermally conductive resin composition, heat conduction members and its manufacturing method, and a thermally conductive adhesion sheet
Document Type and Number:
Japanese Patent JP6131427
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heat conductive member having high heat conductivity and excellent deposition property and substrate followability, and to provide a heat conductive resin composition for producing an adhesive sheet excellent in adhesive property.SOLUTION: A heat conductive resin composition (G) contains 20 to 90 vol% of an easy deformation aggregate (D), 10 to 80 vol% of a binder resin (E) and a solvent (F) dissolving the binder resin (E), and the easy deformation aggregate (D) contains 100 pts.wt. of a spherical heat conductive particle (A) having an average primary particle diameter of 0.1 to 10 μm and 0.1 to 30 pts.wt. of an organic binder (B) and has an average particle diameter of 2 to 100 μm and an average compressive force needed for 10% compression deformation rate of 5 mN or less, and the organic binder (B) constituting the easy deformation aggregate (D) is not dissolved in the solvent (F).
Inventors:
Kaori Sakaguchi
Sakamoto atmosphere
Takahiro Matsuzawa
Taishi Ota
Takanori Ito
Sakamoto atmosphere
Takahiro Matsuzawa
Taishi Ota
Takanori Ito
Application Number:
JP2013144076A
Publication Date:
May 24, 2017
Filing Date:
July 10, 2013
Export Citation:
Assignee:
Toyo Ink sc Holdings Co., Ltd.
Toyochem Co., Ltd.
Toyochem Co., Ltd.
International Classes:
C08L101/00; C08K3/22; C08K3/28; C08K7/16; C08L101/14; C09J7/02
Domestic Patent References:
| JP2005036016A | ||||
| JP2008510878A | ||||
| JP2009249226A | ||||
| JP2014003261A |
Foreign References:
| WO2009041300A1 | ||||
| WO2012070289A1 |