Title:
WAFER CHUCK FOR VACUUM PROBER, AND VACUUM PROBER DEVICE
Document Type and Number:
Japanese Patent JP2018074099
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To transmit heat flux, generated by a heat exchange metal unit, efficiently to a wafer.SOLUTION: In a wafer chuck 100 where a heat exchange metal unit 30, an insulation layer 20, and a chuck top 10 for fixing a wafer 50 are laminated in this order, plate-like metal elastic members 40a, 40b are interposed between the heat exchange metal unit 30 and the insulation layer 20, and/or between the insulation layer 20 and the chuck top 10. Furthermore, the wafer 50 is retained to the chuck top 10 by means of a retainer 15, and nitrogen gas is distributed between the chuck top 10 and the wafer 50.SELECTED DRAWING: Figure 3
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Inventors:
YANAI HIROBUMI
Application Number:
JP2016216146A
Publication Date:
May 10, 2018
Filing Date:
November 04, 2016
Export Citation:
Assignee:
HISOL INC
International Classes:
H01L21/683; H01L21/66
Attorney, Agent or Firm:
Isono International Patent and Trademark Office
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