Title:
チップ保護用フィルム
Document Type and Number:
Japanese Patent JP4851434
Kind Code:
B2
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Inventors:
Takanori Yamakawa
Yasumasa Morishima
Shinichi Ishiwata
Yasumasa Morishima
Shinichi Ishiwata
Application Number:
JP2007325974A
Publication Date:
January 11, 2012
Filing Date:
December 18, 2007
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
H01L21/301; B32B27/38; H01L21/683; C09D7/12; C09D109/02; C09D163/00; C09D177/00; C09D201/00
Domestic Patent References:
| JP2006147623A | ||||
| JP2005279977A | ||||
| JP2007158026A |
Attorney, Agent or Firm:
Ryo Matsushita