Title:
ADHESIVE PATCH WITH COVER MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/080103
Kind Code:
A1
Abstract:
This adhesive patch with cover material comprises an adhesive patch part which has a support body and a medicinal layer that is formed on the support body, and a cover part which has a cover layer and a cover adhesive layer that is formed on the cover layer, wherein the cover adhesive layer is joined to the support body so as to cover the adhesive patch part. The cover layer is made from a nonwoven fabric, and has a coefficient of extension of 50-300% in the flow direction and the width direction. The cover adhesive layer is formed using a rubber adhesive that has a rubber adhesive base as a main adhesive base thereof, and has a loss tangent (tan δ) of 0.7-0.95 at 30ºC and 0.1Hz.
Inventors:
KURIBAYASHI MITSURU (JP)
TAKEO MASAFUMI (JP)
TAKEO MASAFUMI (JP)
Application Number:
PCT/JP2022/040616
Publication Date:
May 11, 2023
Filing Date:
October 31, 2022
Export Citation:
Assignee:
HISAMITSU PHARMACEUTICAL CO (JP)
International Classes:
A61K9/70; A61K47/32
Domestic Patent References:
| WO2015087927A1 | 2015-06-18 | |||
| WO2021201152A1 | 2021-10-07 | |||
| WO2020175395A1 | 2020-09-03 | |||
| WO2020071205A1 | 2020-04-09 |
Foreign References:
| JP2021180374A | 2021-11-18 | |||
| JPH11343232A | 1999-12-14 |
Attorney, Agent or Firm:
SHIGA INTERNATIONAL PATENT OFFICE (JP)
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