Title:
AMIDE COMPOUND AND CURABLE RESIN COMPOSITION CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2023/074481
Kind Code:
A1
Abstract:
The present invention provides a compound (in particular, a curing agent) which enables the achievement of a cured product that has excellent flexibility and excellent dielectric characteristics, while maintaining adequate heat resistance and mechanical characteristics. The present invention relates to an amide compound which is represented by general formula (1). (In formula (1), R represents a hydrogen atom or an aryl group; X represents a divalent hydrocarbon group derived from an aliphatic dicarboxylic acid having 10 or more carbon atoms; Y represents a divalent hydrocarbon group derived from an aliphatic diamine having 10 or more carbon atoms; and n represents a number of 1 or more.)
Inventors:
TAKUBO YUKI (JP)
NAKAI MAKOTO (JP)
ONO RYOHEI (JP)
NAKAI MAKOTO (JP)
ONO RYOHEI (JP)
Application Number:
PCT/JP2022/038853
Publication Date:
May 04, 2023
Filing Date:
October 19, 2022
Export Citation:
Assignee:
UNITIKA LTD (JP)
International Classes:
C07D209/48; C08G59/42; C08G69/48
Domestic Patent References:
| WO2020158493A1 | 2020-08-06 |
Foreign References:
| AT383138B | 1987-05-25 | |||
| JP2020186208A | 2020-11-19 | |||
| US3882085A | 1975-05-06 | |||
| JPH04356541A | 1992-12-10 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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