Title:
ANISOTROPIC CONDUCTIVE FILM, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/116988
Kind Code:
A1
Abstract:
Provided is an anisotropic conductive film that has high adhesive strength. An anisotropic conductive film according to the present invention comprises: a binder composition containing an epoxy compound and a film formation component; an anionic latent curing agent that cures the epoxy compound; a silane coupling agent which has two or more mercapto groups within the molecule and in which the main chain is an organic chain; and conductive particles.
Inventors:
KITADUME KOJI (JP)
Application Number:
PCT/JP2023/041947
Publication Date:
June 06, 2024
Filing Date:
November 22, 2023
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H01B1/22; C09J7/38; C09J11/04; C09J11/06; C09J11/08; C09J163/00; H01B5/16
Foreign References:
| JP2007317563A | 2007-12-06 | |||
| JP2022149538A | 2022-10-07 |
Attorney, Agent or Firm:
TORANOMON INTELLECTUAL PROPERTY FIRM (JP)
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