Title:
APPARATUS FOR MEASURING HEIGHT OF BONDING WIRE
Document Type and Number:
WIPO Patent Application WO/1998/040695
Kind Code:
A1
Abstract:
An apparatus (21) for measuring the height of a bonding wire is provided in a position above bonding wires (25) with a laser beam generator (22) having a laser beam focusing mechanism (22h), and a laser beam (22k) outputted from this laser beam generator (22) is reflected upon the bonding wires, objects to be measured, the reflected laser beam (22k) being received to determine the height of the bonding wires (25).
Inventors:
KATO AKIHARU (JP)
FUKUDA SADAO (JP)
FUKUDA SADAO (JP)
Application Number:
PCT/JP1997/000801
Publication Date:
September 17, 1998
Filing Date:
March 13, 1997
Export Citation:
Assignee:
TSUKUBA SEIKO LTD (JP)
KATO AKIHARU (JP)
FUKUDA SADAO (JP)
KATO AKIHARU (JP)
FUKUDA SADAO (JP)
International Classes:
G01B11/02; G01B11/06; H01L21/60; H01L21/66; (IPC1-7): G01B11/02; G01B11/24
Foreign References:
| JPH08334317A | 1996-12-17 | |||
| JPH04148544A | 1992-05-21 | |||
| JPH0415507A | 1992-01-20 |
Attorney, Agent or Firm:
Nishiwaki, Tamio (2-11-18 Tomiok, Koto-ku Tokyo 135, JP)
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