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Title:
BONDING MATERIAL AND BONDING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/248664
Kind Code:
A1
Abstract:
This bonding material comprises: a solder alloy having a median diameter D50 of 100-2,000 nm, consisting of Sn, Bi, In, and other inevitable components, and having a melting point of at most 100 °C; metal nanoparticles, which are Cu nanoparticles having a median diameter D50 of 50-500 nm; and a flux, wherein each of the metal nanoparticles has, on the surface thereof , a protective film that is detached at a temperature higher than the melting point of the solder alloy and lower than 100 °C, and the weight ratio of the solder alloy to the metal nanoparticles is the ratio at which all Sn and In contained in the solder alloy form intermetallic compounds with the metal nanoparticles, in the equilibrium phase diagram.

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Inventors:
HINE KIYOHIRO
TAKAO YUMI
HINO HIROHISA
ISHITANI SHINJI
FURUSAWA AKIO
Application Number:
PCT/JP2023/018864
Publication Date:
December 28, 2023
Filing Date:
May 22, 2023
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B22F1/00; B22F1/052; B22F1/054; B22F1/102; B22F7/08; B23K35/14; B23K35/26; C22C12/00
Domestic Patent References:
WO2009011392A12009-01-22
WO2018164171A12018-09-13
WO2018025798A12018-02-08
WO2008016140A12008-02-07
Foreign References:
JP2005229113A2005-08-25
JP2002120085A2002-04-23
JP2017080797A2017-05-18
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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