Title:
CAPACITOR-EQUIPPED SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2007/029445
Kind Code:
A1
Abstract:
A capacitor-equipped semiconductor device includes: a semiconductor chip
(12) having a plurality of electrode terminals (16, 18); a sheet-shaped substrate
(20) having at least a film-shaped capacitor; and a mounting substrate (32) having
chip connection terminals (36a, 36b) arranged to correspond to the electrode
terminals (16, 18) of the semiconductor chip (12) and a ground terminal (36c)
arranged to correspond to one (28c) of the electrodes of the film-shaped capacitor
of the sheet-shaped substrate (20) on one surface,and an external connection
terminal connected to the chip connection terminals (36a, 36b) and a ground terminal
(36c) for mounting on an external substrate on the other surface.
Inventors:
YAMAMOTO KENICHI
SUETSUGU DAISUKE
KOMYOJI DAIDO
SUETSUGU DAISUKE
KOMYOJI DAIDO
Application Number:
PCT/JP2006/315708
Publication Date:
March 15, 2007
Filing Date:
August 09, 2006
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
YAMAMOTO KENICHI
SUETSUGU DAISUKE
KOMYOJI DAIDO
YAMAMOTO KENICHI
SUETSUGU DAISUKE
KOMYOJI DAIDO
International Classes:
H01L25/00; H01L23/12
Foreign References:
| JPH1093002A | 1998-04-10 | |||
| JPH05267557A | 1993-10-15 | |||
| JPS634662A | 1988-01-09 | |||
| JP2005203775A | 2005-07-28 | |||
| JP2000208669A | 2000-07-28 |
Attorney, Agent or Firm:
IWAHASHI, Fumio et al. (Electric Industrial Co. Ltd., 1006, Oaza Kadom, Kadoma-shi Osaka 01, JP)
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