Title:
CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/195451
Kind Code:
A1
Abstract:
This ceramic electronic component comprises a main body (1), which has ceramic as the main material, has a first surface (41) and main body side surfaces perpendicular to the first surface (41), and a side-surface electrode (3) arranged so as to cover at least a portion of the main body side surfaces (42). At least a portion of the ends of the first surface (41) on the side close to the main body side surfaces (42) is formed by an underlayer electrode (5) arranged so as to extend along the first surface (41). The main body (1) comprises an auxiliary conductor (6) at the boundary between the first surface (41) and the main body side surfaces (42). The auxiliary conductor (6) is directly connected to a lower surface of the underlayer electrode (5), and is directly connected to a portion of the side-surface electrode (3) covering at least a portion of the main body side surfaces (42).
Inventors:
OIE HIROFUMI (JP)
Application Number:
PCT/JP2023/013832
Publication Date:
October 12, 2023
Filing Date:
April 03, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G4/30
Foreign References:
| JP2003282356A | 2003-10-03 | |||
| JP2012253245A | 2012-12-20 | |||
| JP2015111655A | 2015-06-18 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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