Title:
CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/195450
Kind Code:
A1
Abstract:
A ceramic electronic component (101) is provided with a body (1) having a structure in which a plurality of ceramic layers are stacked in a first direction (91). A coil is formed inside the body (1). The coil includes: a first conductor via (41) and a second conductor via (42) which are spaced apart from each other in a second direction (92) perpendicular to the first direction (91) inside the body (1) and are disposed to extend in the first direction (91); a first conductor pattern (51); and a second conductor pattern (52). At least a part of each of the first conductor pattern (51) and the second conductor pattern (52) is in the shape of a line extending in the second direction (92) inside the body (1). The first conductor via (41) and the second conductor via (42) are connected by both the first conductor pattern (51) and the second conductor pattern (52). A portion of the first conductor pattern (51) midway between the first conductor via (41) and the second conductor via (42) and a portion of the second conductor pattern (52) midway between the first conductor via (41) and the second conductor via (42) are connected by one or more central conductor vias (4).
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Inventors:
OIE HIROFUMI (JP)
Application Number:
PCT/JP2023/013831
Publication Date:
October 12, 2023
Filing Date:
April 03, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F17/00
Foreign References:
| JPH02256208A | 1990-10-17 | |||
| JP2018050022A | 2018-03-29 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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