CIRCUIT BOARD AND PHOTOIRRADIATION DEVICE USING SAME

Title:

CIRCUIT BOARD AND PHOTOIRRADIATION DEVICE USING SAME

Document Type and Number:

WIPO Patent Application WO/2016/009830

Kind Code:

A1

Abstract:

The present invention is a circuit board that uses a base substrate formed from metal, wherein electronic components can be easily welded manually. The circuit board comprises a base substrate (21) formed from metal and a wiring conductor layer (23) formed on a top surface (21a) of the base substrate (21) via an insulating layer (22). The wiring conductor layer (23) has an individual soldering region (R2) for soldering electronic components of external leads. Moreover, all of or a part of a portion (21X) of the base substrate (21) corresponding to the individual soldering region (R2) is removed.

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Inventors:

TOGAWA TAKUZO (JP)
MORI TAKAHIRO (JP)

Application Number:

PCT/JP2015/068946

Publication Date:

January 21, 2016

Filing Date:

July 01, 2015

Export Citation:

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Assignee:

CCS INC (JP)

International Classes:

H05K1/02; H05K1/05

Foreign References:

JP2013211523A	2013-10-10
JP2012004525A	2012-01-05
JPH03136291A	1991-06-11
JP2006222182A	2006-08-24
JP2011091033A	2011-05-06

Attorney, Agent or Firm:

NISHIMURA, RYUHEI (JP)
Ryuhei Nishimura (JP)

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