Title:
SEMICONDUCTOR PACKAGE ENABLING DIRECT DIE-ATTACHMENT
Document Type and Number:
Japanese Patent JPH08125315
Kind Code:
A
Abstract:
PURPOSE: To provide an inexpensive and highly reliable semiconductor package which enables direct adhesion without adopting die-attaching technique which is usually used when mounting a semiconductor element in a a semiconductor package production process.
CONSTITUTION: A semiconductor package is obtained, wherein a metallic base substrate with a copper foil layer wherein a circuit is machined through an insulation layer on a metallic plate is used and a semiconductor element is thermally compressed directly on an adherent insulation layer wherein a semiconductor package with a brim part which is machined into a soup dish shape through press molding, etc., in the metallic base substrate.
Inventors:
NAGAMINE KUNIHIRO
TAKAHASHI SEIICHI
KANEMITSU KINICHI
MINETA NAOSHI
TAKAHASHI SEIICHI
KANEMITSU KINICHI
MINETA NAOSHI
Application Number:
JP25572094A
Publication Date:
May 17, 1996
Filing Date:
October 20, 1994
Export Citation:
Assignee:
MITSUI TOATSU CHEMICALS
International Classes:
H05K3/32; H05K1/02; H05K1/05; H05K1/00; (IPC1-7): H05K3/32