CLAY-LIKE MOLDED BODY FOR FORMING NOBLE METAL SINTERED COMPACT

Title:

CLAY-LIKE MOLDED BODY FOR FORMING NOBLE METAL SINTERED COMPACT

Document Type and Number:

WIPO Patent Application WO/2015/080181

Kind Code:

A1

Abstract:

In the present invention, a clay-like molded body for forming a noble metal sintered compact is obtained by forming a clay-like composition containing at least one powder selected from the group consisting of noble metal powders and noble metal alloy powders, an organic binder, an organic additive, and water into a wire shape having a diameter of 0.5 mm to 3.0 mm or a sheet shape having a thickness of 0.2 mm to 3.0 mm, and said clay-like molded body for forming a noble metal sintered compact is characterized in that cracking does not occur when the clay-like molded body is tightly wound once around the outer peripheral surface of a core rod having a cross-sectional circular shape that is 13 mm in diameter.

Inventors:

IDO YASUO (JP)
OTANI SHINJI (JP)

Application Number:

PCT/JP2014/081317

Publication Date:

June 04, 2015

Filing Date:

November 27, 2014

Export Citation:

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Assignee:

MITSUBISHI MATERIALS CORP (JP)

International Classes:

B22F1/102; B22F1/103; B22F3/02; B22F9/00

Domestic Patent References:

WO2014157527A1

2014-10-02

Foreign References:

JP2007154304A	2007-06-21
JP2002097501A	2002-04-02
JP2001234081A	2001-08-28
JP4265127B2	2009-05-20
JPH0426707A	1992-01-29
JP2005187858A	2005-07-14

Other References: