Title:
COMPOSITE FINE PARTICLES, DISPERSION LIQUID, PRODUCTION METHOD AND USE OF SAID COMPOSITE FINE PARTICLES, AND PRODUCTION METHOD AND USE OF SAID DISPERSION LIQUID
Document Type and Number:
WIPO Patent Application WO/2016/125581
Kind Code:
A1
Abstract:
Each of composite fine particles of the present invention is prepared by covering at least a part of the surface of a metal fine particle with a protective layer that contains an acid-decomposable polymer. The thus-obtained composite fine particles are able to be sintered at low temperatures. The composite fine particles may have an average particle diameter of 3,000 nm or less. The metal fine particle may be a copper fine particle. The acid-decomposable polymer may have an acetal bond. A wiring board may be produced by: preparing a conductive ink or conductive paste by adding an acidic compound and/or an acid generator into a dispersion of the composite fine particles; and firing the conductive ink or conductive paste at 200°C or less.
Inventors:
YONEZAWA TETSU (JP)
TANAKA HIROKI (JP)
OSAKA TAKUYA (JP)
OKAMOTO KAZUKI (JP)
TANAKA HIROKI (JP)
OSAKA TAKUYA (JP)
OKAMOTO KAZUKI (JP)
Application Number:
PCT/JP2016/051398
Publication Date:
August 11, 2016
Filing Date:
January 19, 2016
Export Citation:
Assignee:
UNIV HOKKAIDO NAT UNIV CORP (JP)
DAICEL CORP (JP)
DAICEL CORP (JP)
International Classes:
B22F1/00; B22F1/102; B22F9/00; B22F9/24; H01B1/00; H01B1/22; H01B5/00; H01B5/14; H01B13/00; H05K1/09
Foreign References:
| JP2013112888A | 2013-06-10 |
Attorney, Agent or Firm:
KUWATA Mitsuo et al. (JP)
Atsuo Kuwata (JP)
Atsuo Kuwata (JP)
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