Title:
COMPOSITION HAVING METAL PARTICLES DISPERSED THEREIN, AND METHOD FOR FLIP CHIP MOUNTING AND METHOD FOR FORMING BUMP USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2006/095677
Kind Code:
A1
Abstract:
Provided is a resin composition having metal particles dispersed therein which is suitably used in a method for the flip chip mounting or a method for forming a bump. The above composition comprises a first component (3a), a second component (3b), metal particles (1), (1’) and a convection additive. In the second component (3b), metal particles (1), (1’) are dispersed and also a convection additive is contained. At least a part of metal particles (1) has the first component (3a) being built therein, and when metal particles (1) are molten resulting from heating, the first component (3a) is contacted with the second component (3b) to start the formation of a thermosetting resin (3c). The convection additive generates a gas as a result of the heating and causes the convection in the inside of the composition.
Inventors:
HIRANO KOICHI
KARASHIMA SEIJI
ICHIRYU TAKASHI
TOMITA YOSHIHIRO
KARASHIMA SEIJI
ICHIRYU TAKASHI
TOMITA YOSHIHIRO
Application Number:
PCT/JP2006/304256
Publication Date:
September 14, 2006
Filing Date:
March 06, 2006
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
HIRANO KOICHI
KARASHIMA SEIJI
ICHIRYU TAKASHI
TOMITA YOSHIHIRO
HIRANO KOICHI
KARASHIMA SEIJI
ICHIRYU TAKASHI
TOMITA YOSHIHIRO
International Classes:
H01L21/60; H05K3/34
Foreign References:
| JP2004260131A | 2004-09-16 | |||
| JPH0236289A | 1990-02-06 |
Attorney, Agent or Firm:
Kawamiya, Osamu (IMP Building 3-7, Shiromi 1-chome, Chuo-k, Osaka-shi Osaka, JP)
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