Title:
CONDUCTIVE ADHESIVE, ELECTRONIC CIRCUIT USING SAME, AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2022/049937
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a conductive adhesive that can suppress an increase in the electrical resistance value at a joining part between a substrate and an electronic component at a high temperature and a high humidity while keeping the specific resistance value low; an electronic circuit using the conductive adhesive; and a method for producing same. According to the present invention, provided is a conductive adhesive that contains a conductive filler. A coating layer containing silver is provided to the surface of the conductive filler. The amount of the conductive filler blended with respect to the conductive adhesive is 29.0-63.0 vol%. The amount of the silver blended with respect to the conductive adhesive is 3.5-7.0 vol%. Also provided are an electronic circuit using the conductive adhesive according to the present invention, and a method for producing same.
Inventors:
NAKATANI TOSHIO (JP)
MINAMIYAMA HIDEAKI (JP)
MINAMIYAMA HIDEAKI (JP)
Application Number:
PCT/JP2021/028020
Publication Date:
March 10, 2022
Filing Date:
July 29, 2021
Export Citation:
Assignee:
TOYO ALUMINIUM KK (JP)
International Classes:
C09J9/02; C09J11/04; C09J201/00; H01B1/22; H05K1/09; H05K3/38
Domestic Patent References:
| WO2015107996A1 | 2015-07-23 |
Foreign References:
| JP2020100807A | 2020-07-02 | |||
| JP2007019006A | 2007-01-25 | |||
| JP2005317491A | 2005-11-10 | |||
| JP2016207738A | 2016-12-08 | |||
| JP2013149527A | 2013-08-01 | |||
| JP2016222795A | 2016-12-28 |
Attorney, Agent or Firm:
AKAOKA Kazuo et al. (JP)
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