Title:
CONDUCTIVE ADHESIVE AND ELECTRONIC DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2013/115360
Kind Code:
A1
Abstract:
[Problem] To provide: a conductive adhesive which is not susceptible to deterioration in a bonded portion caused by a halogen; and an electronic device which uses the conductive adhesive.
[Solution] A conductive adhesive, which contains a conductive filler and a binder resin, and wherein the binder resin contains an epoxy resin in which the sum of the total chlorine concentration and the total bromine concentration is 300 ppm by mass or less relative to the total amount of the epoxy resin contained in the binder resin. This epoxy resin preferably has a sum of the total chlorine concentration and the total bromine concentration of 50 ppm by mass or less, and is preferably obtained by epoxidizing a carbon-carbon double bond of a starting material compound (a base material) that has a carbon-carbon double bond, while using hydrogen peroxide as an oxidant.
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Inventors:
UCHIDA HIROSHI (JP)
SHINOZAKI KENJI (JP)
ISHIBASHI YOSHITAKA (JP)
SUGANUMA KATSUAKI (JP)
SHINOZAKI KENJI (JP)
ISHIBASHI YOSHITAKA (JP)
SUGANUMA KATSUAKI (JP)
Application Number:
PCT/JP2013/052348
Publication Date:
August 08, 2013
Filing Date:
February 01, 2013
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
UNIV OSAKA (JP)
UNIV OSAKA (JP)
International Classes:
C09J163/00; C09J9/02; C09J11/04; H01B1/00; H01B1/20; H05K3/32
Foreign References:
| JP2000281914A | 2000-10-10 | |||
| JP2010235649A | 2010-10-21 | |||
| JP2000169821A | 2000-06-20 | |||
| JP2004083711A | 2004-03-18 |
Attorney, Agent or Firm:
ARIHARA Motoji (JP)
Motoji Arihara (JP)
Motoji Arihara (JP)
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Claims: