CONDUCTIVE CONTACT TERMINAL TO BE MOUNTED ON A SUBSTRATE SURFACE

Title:

CONDUCTIVE CONTACT TERMINAL TO BE MOUNTED ON A SUBSTRATE SURFACE

Document Type and Number:

WIPO Patent Application WO/2010/134734

Kind Code:

A2

Abstract:

The present invention relates to a conductive contact terminal to be mounted on a substrate surface. The conductive contact terminal to be mounted on a substrate surface according to the present invention comprises: an elastic core which provides elasticity to the contact terminal; a metal layer formed to cover the outer surface of the elastic core; and a conductive adhesive layer interposed between the elastic core and the metal layer to adhere the elastic core and the metal layer together. The conductive contact terminal to be mounted on a substrate surface according to the present invention has low electric resistance, prevents materials from being deformed in a high temperature reflow soldering process, and prevents a loss of conductivity even upon the occurrence of a fracture in the metal layer that provides conductivity to the conductive contact terminal.

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Inventors:

KIM SEON TAE (KR)
LEE HYUNG CHUN (KR)
LEE SANG WON (KR)

Application Number:

PCT/KR2010/003114

Publication Date:

November 25, 2010

Filing Date:

May 17, 2010

Export Citation:

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Assignee:

DOOSUNG IND CO LTD (KR)
KIM SEON TAE (KR)
LEE HYUNG CHUN (KR)
LEE SANG WON (KR)

International Classes:

H05K9/00; H05K3/30

Foreign References:

KR200390490Y1	2005-07-21
KR100783588B1	2007-12-07
KR100839893B1	2008-06-19
KR100892720B1	2009-04-15

Other References: