Title:
CONDUCTIVE PARTICLES, CONDUCTIVE POWDER, CONDUCTIVE POLYMER COMPOSITION AND ANISOTROPIC CONDUCTIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2016/063684
Kind Code:
A1
Abstract:
Provided are: conductive particles which have good conductivity and volume resistivity that is remarkably lower than those of conventional conductive particles, and which is preferably obtained at low cost; a conductive powder; a conductive polymer composition; and an anisotropic conductive sheet. Each conductive particle 10 comprises a first plating layer 12 (a pure Ni plating layer or an Ni plating layer containing 4.0% by mass or less of P) that covers the surface of a spherical Ni core 11 that contains 5-15% by mass (inclusive) of P. In addition, each conductive particle may also comprise an Au plating layer that covers the surface of the first plating layer 12 and has a thickness of 5-200 nm. The conductive powder is a powder that contains the conductive particles and has a median size d50 of 3-100 μm, while satisfying (d90 - d10)/d50 ≤ 0.8. The conductive polymer composition contains the conductive powder and a polymer. The anisotropic conductive sheet is formed from the conductive polymer composition, so that the conductive particles are arranged in the thickness direction thereof.
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Inventors:
MORI HIDETO (JP)
NOZAKA TSUTOMU (JP)
NOZAKA TSUTOMU (JP)
Application Number:
PCT/JP2015/077414
Publication Date:
April 28, 2016
Filing Date:
September 29, 2015
Export Citation:
Assignee:
HITACHI METALS LTD (JP)
International Classes:
B22F1/00; B22F1/17; C22C19/03; H01B1/00; H01B1/22; H01B5/00; H01B5/16; B22F9/24
Foreign References:
| JP2010073681A | 2010-04-02 | |||
| JP2006131978A | 2006-05-25 | |||
| JP2003034879A | 2003-02-07 |
Other References:
See also references of EP 3210696A4
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