Title:
CONTROL DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/148800
Kind Code:
A1
Abstract:
The purpose of the present invention is to improve the characteristics of heat dissipation via a printed wiring board in a control device in which a surface mounted type of switching element is used. This control device is provided with a printed wiring board (4), a switching element (5) disposed on the printed wiring board, and a heat conducting member (6) thermally connected to the switching element on a surface of the switching element on the side opposite to a surface facing the printed wiring board. The printed wiring board has a multilayer structure in which a plurality of heat conducting layers (2) are stacked in an insulating layer. The switching element is thermally connected to the upper-most heat conducting layer (2a) in a predetermined region of the upper-most heat conducting layer. The heat conducting member is thermally connected to the upper-most heat conducting layer in a region other than the predetermined region. The printed wiring board is provided with a first via (9a) thermally connecting the plurality of heat conducting layers under the switching element, and a second via (9b) thermally connecting the plurality of heat conducting layers under the heat conducting member.
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Inventors:
NEMOTO YUJI (JP)
NAKAGAWA AKIRA (JP)
OGAWA TORU (JP)
NAKAGAWA AKIRA (JP)
OGAWA TORU (JP)
Application Number:
PCT/JP2019/000884
Publication Date:
July 23, 2020
Filing Date:
January 15, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H05K3/46; H01L25/07; H01L25/18; H05K1/02; H05K7/20
Foreign References:
| JP2010245174A | 2010-10-28 | |||
| JP2016213375A | 2016-12-15 | |||
| US20020047193A1 | 2002-04-25 | |||
| KR20180024434A | 2018-03-08 | |||
| JP2006173290A | 2006-06-29 |
Attorney, Agent or Firm:
OIWA Masuo et al. (JP)
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