Title:
COOLING STRUCTURE AND HEATSINK
Document Type and Number:
WIPO Patent Application WO/2021/131175
Kind Code:
A1
Abstract:
A heatsink 1 comprises a cooling body unit 10 to which a plurality of elements 2 are mounted in parallel. In the cooling body unit 10, a refrigerant inflow path 11, circulating paths 12 for the refrigerant supplied from the inflow path 11, and an outflow path 13 for the refrigerant supplied from the circulating paths 12 are formed. The circulating paths 12 are formed in correspondence to the location at which the elements 2 are mounted. A plurality of fins 14 densely rise from one surface of the circulating paths 12.
Inventors:
UETAKA YUSUKE (JP)
Application Number:
PCT/JP2020/034119
Publication Date:
July 01, 2021
Filing Date:
September 09, 2020
Export Citation:
Assignee:
MEIDENSHA ELECTRIC MFG CO LTD (JP)
International Classes:
H01L23/473; H05K7/20
Domestic Patent References:
| WO2014069174A1 | 2014-05-08 | |||
| WO2016194158A1 | 2016-12-08 |
Foreign References:
| JP2013219127A | 2013-10-24 | |||
| JPH02291154A | 1990-11-30 | |||
| JP2007214157A | 2007-08-23 |
Attorney, Agent or Firm:
KOBAYASHI, Hiromichi et al. (JP)
Download PDF:
Previous Patent: CENTRIFUGAL FIELD FLOW FRACTIONATION DEVICE
Next Patent: VEHICLE ALARM AND METHOD FOR MANUFACTURING SOLENOID PART
Next Patent: VEHICLE ALARM AND METHOD FOR MANUFACTURING SOLENOID PART