Title:
COPPER-FINE-PARTICLE DISPERSION LIQUID, CONDUCTIVE-FILM FORMATION METHOD, AND CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2014/185101
Kind Code:
A1
Abstract:
Provided is a copper-fine-particle dispersion liquid with which photosintering can be used to form, upon an inorganic base material, a conductive film exhibiting excellent adhesive properties. This copper-fine-particle dispersion liquid (1) includes a dispersion medium and copper fine particles (11). The copper fine particles (11) are dispersed in the dispersion medium. The copper-fine-particle dispersion liquid (1) includes an adhesion improver for improving adhesive properties between a base material, and a conductive film (4) to be formed upon the base material by photosintering the copper fine particles (11). The base material is an inorganic base material (3). The adhesion improver is a phosphorus-containing compound. Accordingly, the adhesion improver improves the adhesive properties between the conductive film (4) and the inorganic base material (3).
Inventors:
KAWATO YUICHI (JP)
ARIMURA HIDETOSHI (JP)
KUDO TOMIO (JP)
ARIMURA HIDETOSHI (JP)
KUDO TOMIO (JP)
Application Number:
PCT/JP2014/052221
Publication Date:
November 20, 2014
Filing Date:
January 31, 2014
Export Citation:
Assignee:
ISHIHARA CHEMICAL CO LTD (JP)
International Classes:
H01B1/22; B22F7/04; B22F9/00; C09D5/24; C09D7/12; H01B1/02; H01B5/14; H01B13/00; H05K1/09; H05K3/10
Foreign References:
| JP5088760B1 | 2012-12-05 | |||
| JP5088761B1 | 2012-12-05 | |||
| JP2011527089A | 2011-10-20 | |||
| JP2010528428A | 2010-08-19 | |||
| JP2004277832A | 2004-10-07 |
Attorney, Agent or Firm:
NOGUCHI, YASUHIRO (JP)
Yasuhiro Noguchi (JP)
Yasuhiro Noguchi (JP)
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