Title:
PHOTO/MOISTURE CURABLE RESIN COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENTS, CURED BODY AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2021/230372
Kind Code:
A1
Abstract:
This photo/moisture curable resin composition contains (A) a radically polymerizable compound, (B) a moisture curable resin and (C) a photopolymerization initiator. If this photo/moisture curable resin composition is applied, in the form of a line having a width of 1.0 mm, to a polycarbonate plate and is photocured by being irradiated with ultraviolet light of 1,000 mJ/cm2, and a glass plate is subsequently compression bonded thereto at 0.2 MPa for 10 seconds, a/b is from 0.5 to 0.95 where a is the average width of the glass plate-side bonding portion and b is the average width of the polycarbonate plate-side bonding portion, and the viscosity as measured with use of a cone-plate viscometer at 25°C at 5.0 rpm is from 40 Pa·s to 600 Pa·s.
Inventors:
ISHIDATE RYOMA (JP)
SHIOJIMA MOTOMI (JP)
KAWADA SHINJI (JP)
SHIOJIMA MOTOMI (JP)
KAWADA SHINJI (JP)
Application Number:
PCT/JP2021/018496
Publication Date:
November 18, 2021
Filing Date:
May 14, 2021
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08F283/00; C08F2/44; C08G18/30; C09J4/06; C09J11/04; C09J175/04
Domestic Patent References:
| WO2020085284A1 | 2020-04-30 |
Foreign References:
| JP2015521226A | 2015-07-27 | |||
| JP2019509360A | 2019-04-04 | |||
| JP2016074781A | 2016-05-12 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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