Title:
PHOTO/MOISTURE-CURABLE RESIN COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENT, CURED BODY AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2021/230373
Kind Code:
A1
Abstract:
A photo/moisture-curable resin composition according to the present invention comprises a radically polymerizable compound (A), a moisture curable resin (B) and a photopolymerization initiator (C), and after being photocured by being irradiated with 1000 mJ/cm2 of UV irradiation, the storage modulus (G') at 25°C as measured at 1 Hz by a dynamic viscoelasticity measurement device is at least 250 kPa, and the tanδ at 75°C is at least 1.0.
Inventors:
ISHIDATE RYOMA (JP)
SHIOJIMA MOTOMI (JP)
KAWADA SHINJI (JP)
SHIOJIMA MOTOMI (JP)
KAWADA SHINJI (JP)
Application Number:
PCT/JP2021/018498
Publication Date:
November 18, 2021
Filing Date:
May 14, 2021
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08F283/00; C08F2/44; C08G18/30; C09J4/06; C09J11/04; C09J175/04
Domestic Patent References:
| WO2020085284A1 | 2020-04-30 | |||
| WO2015056478A1 | 2015-04-23 | |||
| WO2020149379A1 | 2020-07-23 |
Foreign References:
| JP2020045403A | 2020-03-26 | |||
| JP2016074891A | 2016-05-12 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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