Title:
DEPOSITION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/052236
Kind Code:
A2
Abstract:
The technical objective of the present invention is to provide a deposition apparatus capable of protecting a surface of a substrate from a contaminant attached to a deposition nozzle. To this end, a deposition apparatus of the present invention, which is a deposition apparatus for depositing one or more thin film-forming materials on a substrate, comprises: a first linear evaporation source having a first conductance tube in which a plurality of deposition nozzles for spraying a first thin film-forming material onto the substrate are arranged long in a first direction; a fixed shielding member comprising a passage region which is provided between the first conductance tube and the substrate to pass a portion of the sprayed first thin film-forming material onto the substrate, and a shielding region which blocks the remaining portion of the first thin film-forming material; and a first contamination preventing member, provided in the fixed shielding member, for preventing a contaminant attached to at least one deposition nozzle from among the plurality of deposition nozzles from moving to the substrate.
Inventors:
MOON IL KWON (KR)
HWANG DO WEON (KR)
HWANG DO WEON (KR)
Application Number:
PCT/KR2017/010016
Publication Date:
March 22, 2018
Filing Date:
September 13, 2017
Export Citation:
Assignee:
ALPHA PLUS CO LTD (KR)
Attorney, Agent or Firm:
MI PATENT AND LAW FIRM (KR)
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