Title:
DIELECTRIC RESIN FILM AND FILM CAPACITOR
Document Type and Number:
WIPO Patent Application WO/2023/204176
Kind Code:
A1
Abstract:
Provided is a dielectric resin film that makes it possible to form a film capacitor that has excellent self-recovery capability and does not easily lose capacitance when high voltage is applied. A dielectric resin film according to the present invention comprises: a dielectric resin film body that has two opposite principal surfaces; and one or more insulating protrusions that are provided on at least one of the principal surfaces. The density of the protrusions is at least 1/cm2 but no more than 10/cm2, the average height of the protrusions is at least 2 μm, and the average area of the protrusions as seen from the normal direction to the principal surface is at least 550 μm2.
Inventors:
YAMAZAKI KAZUTO (JP)
ICHIKAWA TOMOMICHI (JP)
ICHIKAWA TOMOMICHI (JP)
Application Number:
PCT/JP2023/015314
Publication Date:
October 26, 2023
Filing Date:
April 17, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G4/18; H01G4/32
Domestic Patent References:
| WO2022075357A1 | 2022-04-14 |
Foreign References:
| JP2015088553A | 2015-05-07 | |||
| JPH04315410A | 1992-11-06 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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