Title:
EDDY CURRENT INSPECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2022/259444
Kind Code:
A1
Abstract:
The purpose of the present disclosure is to provide an inspection method capable of determining the bonding state of an electrode, which is an object to be inspected to, to a substrate without contacting the electrode. A probe (1) with a built-in coil to which an AC current is being applied is scanned along the formation direction of an electrode lead (40) which is an object to be inspected. During scanning, the probe (1) with a built-in coil is positioned above the surface of the electrode lead (40) at a predetermined distance therefrom without contacting the electrode lead (40). A plurality of detection signals corresponding to a plurality of ultrasonic joints (41) are obtained by an eddy current measuring device (3). Finally, the bonding state of the electrode lead (40) to a substrate (30) is determined based on the result of comparison between each of the plurality of detection signals and a reference level. That is, it is determined whether each of the plurality of ultrasonic joints (41) provided on the electrode lead (40) is in an unbonded state, a fractured state, or a normal state.
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Inventors:
IWAO YUSUKE (JP)
Application Number:
PCT/JP2021/022046
Publication Date:
December 15, 2022
Filing Date:
June 10, 2021
Export Citation:
Assignee:
TOSHIBA MITSUBISHI ELEC IND (JP)
International Classes:
G01N27/90
Foreign References:
| JP2003035738A | 2003-02-07 | |||
| JP2009229337A | 2009-10-08 | |||
| JPS5287662A | 1977-07-21 | |||
| JPH10288605A | 1998-10-27 | |||
| JP2015052467A | 2015-03-19 | |||
| US20050104585A1 | 2005-05-19 | |||
| US20070096751A1 | 2007-05-03 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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