Title:
ELECTRICALLY CONDUCTIVE ADHESIVE AGENT, JOINED BODY, AND JOINT
Document Type and Number:
WIPO Patent Application WO/2015/019666
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an electrically conductive adhesive agent which can cure a heat-curable resin within a short time. The electrically conductive adhesive agent comprises a Sn-containing electrically conductive metal powder, a heat-curable resin, an acid anhydride-type curing agent and an organic acid, wherein the electrically conductive metal powder and the organic acid are reacted with each other during heating and an organic acid metal salt produced by the reaction can serve as a curing accelerator. The electrically conductive adhesive agent can cure a heat-curable resin within a short time, for example, within a time equivalent to the time required for a generally-employed reflow treatment.
Inventors:
MIZOWAKI TOSHIO (JP)
TAKAGI YOSHINORI (JP)
TAKAGI YOSHINORI (JP)
Application Number:
PCT/JP2014/060728
Publication Date:
February 12, 2015
Filing Date:
April 15, 2014
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
C09J201/00; B22F1/10; B22F1/103; B22F9/00; C09J11/04; C09J11/06; C09J163/00; H01B1/22; H05K3/34
Foreign References:
| JP2012188646A | 2012-10-04 | |||
| JP2004277701A | 2004-10-07 | |||
| JP2006265484A | 2006-10-05 | |||
| JP2012054518A | 2012-03-15 | |||
| JP2000192000A | 2000-07-11 | |||
| JP2006199937A | 2006-08-03 | |||
| JP2011061241A | 2011-03-24 | |||
| JP2012067274A | 2012-04-05 | |||
| JP2001219294A | 2001-08-14 | |||
| JP2010144150A | 2010-07-01 |
Other References:
MOTOMASA YONEZUMI ET AL.: "Analysis of Curing Reaction for Resin-Enhanced Solder Metal Paste", PANASONIC TECHNICAL JOURNAL, vol. 59, no. 1, April 2013 (2013-04-01), pages 72 - 77, XP008182176
PANASONIC TECHNICAL JOURNAL, vol. 59, no. 1, pages 72 - 77
See also references of EP 3031876A4
PANASONIC TECHNICAL JOURNAL, vol. 59, no. 1, pages 72 - 77
See also references of EP 3031876A4
Attorney, Agent or Firm:
YAMAGUCHI INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Yamaguchi international patent firm (JP)
Patent business corporation Yamaguchi international patent firm (JP)
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