Title:
ELECTROLYTIC PROCESSING APPARATUS AND METHOD
Document Type and Number:
WIPO Patent Application WO2003029531
Kind Code:
A3
Abstract:
There is provided an electrolytic processing apparatus and method which, while omitting a CMP treatment entirely or reducing a load upon a CMP treatment to the least possible extent, can process a conductive material formed in the surface of a substrate to flatten the material, or can remove (clean) extraneous matter adhering to the surface of a workpiece such as a substrate. The electrolytic processing apparatus includes: a pair of electrodes disposed at a given distance; an ion exchange disposed between the pair of electrodes; and a liquid supply section for supplying a liquid between the pair of electrodes. The electrolytic processing method includes: providing an electrode section having a pair of electrodes disposed at a given distance with an ion exchanger being interposed; and bringing the electrode into contact with or close to a workpiece while supplying a fluid to the ion exchanger, thereby processing the surface of the workpiece.
Inventors:
KOBATA ITSUKI (JP)
SHIRAKASHI MITSUHIKO (JP)
KUMEKAWA MASAYUKI (JP)
SAITO TAKAYUKI (JP)
TOMA YASUSHI (JP)
SUZUKI TSUKURU (JP)
YAMADA KAORU (JP)
MAKITA YUJI (JP)
YASUDA HOZUMI (JP)
NOJI IKUTARO (JP)
FUJIWARA KUNIO (JP)
NABEYA OSAMU (JP)
SHIRAKASHI MITSUHIKO (JP)
KUMEKAWA MASAYUKI (JP)
SAITO TAKAYUKI (JP)
TOMA YASUSHI (JP)
SUZUKI TSUKURU (JP)
YAMADA KAORU (JP)
MAKITA YUJI (JP)
YASUDA HOZUMI (JP)
NOJI IKUTARO (JP)
FUJIWARA KUNIO (JP)
NABEYA OSAMU (JP)
Application Number:
PCT/JP2002/009256
Publication Date:
April 22, 2004
Filing Date:
September 11, 2002
Export Citation:
Assignee:
EBARA CORP (JP)
KOBATA ITSUKI (JP)
SHIRAKASHI MITSUHIKO (JP)
KUMEKAWA MASAYUKI (JP)
SAITO TAKAYUKI (JP)
TOMA YASUSHI (JP)
SUZUKI TSUKURU (JP)
YAMADA KAORU (JP)
MAKITA YUJI (JP)
YASUDA HOZUMI (JP)
NOJI IKUTARO (JP)
FUJIWARA KUNIO (JP)
NABEYA OSAMU (JP)
KOBATA ITSUKI (JP)
SHIRAKASHI MITSUHIKO (JP)
KUMEKAWA MASAYUKI (JP)
SAITO TAKAYUKI (JP)
TOMA YASUSHI (JP)
SUZUKI TSUKURU (JP)
YAMADA KAORU (JP)
MAKITA YUJI (JP)
YASUDA HOZUMI (JP)
NOJI IKUTARO (JP)
FUJIWARA KUNIO (JP)
NABEYA OSAMU (JP)
International Classes:
B23H5/08; C08F2/58; C23F3/00; C23G3/00; C25F1/00; C25F3/00; C25F7/00; H01L21/321; H01L21/3213; (IPC1-7): C25F1/00; C25F3/00; C25F7/00; H01L21/3213
Domestic Patent References:
| WO2002103771A1 | 2002-12-27 | |||
| WO2003054255A1 | 2003-07-03 | |||
| WO2001032960A2 | 2001-05-10 |
Foreign References:
| EP1079003A2 | 2001-02-28 | |||
| EP1139400A1 | 2001-10-04 | |||
| EP0750334A2 | 1996-12-27 | |||
| US5258109A | 1993-11-02 | |||
| US3883383A | 1975-05-13 | |||
| US6176995B1 | 2001-01-23 | |||
| EP0765953A1 | 1997-04-02 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 08 30 June 1998 (1998-06-30)
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 09 13 October 2000 (2000-10-13)
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 08 6 October 2000 (2000-10-06)
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 09 13 October 2000 (2000-10-13)
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 08 6 October 2000 (2000-10-06)
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