Title:
ELECTRONIC COMPONENT ACCOMMODATION BODY AND ELECTRONIC COMPONENT ACCOMMODATION BODY PACKAGING
Document Type and Number:
WIPO Patent Application WO/2024/090266
Kind Code:
A1
Abstract:
This electronic component accommodation body (101) comprises a bulk case (2) in which a plurality of electronic components (3) can be accommodated, and an RFID tag (20) for identifying the bulk case (2), the RFID tag (20) having an RFID module (7) and an antenna (18) that is capable of electromagnetically coupling with the RFID module (7), and the antenna (18) being displaceable relative to the RFID module (7). This yields an electronic component accommodation body and an electronic component accommodation body packaging with which it is possible to change the RFID communication distance in accordance with a reading target.
Inventors:
MURAYAMA HIROMI (JP)
IKUNO TOSHINORI (JP)
IKUNO TOSHINORI (JP)
Application Number:
PCT/JP2023/037390
Publication Date:
May 02, 2024
Filing Date:
October 16, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
B65D85/86; B65D25/02; G06K19/077
Domestic Patent References:
| WO2022181557A1 | 2022-09-01 | |||
| WO2020079961A1 | 2020-04-23 |
Foreign References:
| JP2022143817A | 2022-10-03 | |||
| JP2022147343A | 2022-10-06 | |||
| JP2011097256A | 2011-05-12 | |||
| JP2005348030A | 2005-12-15 | |||
| US5881782A | 1999-03-16 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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