Title:
ELECTRONIC COMPONENT ACCOMMODATION BODY AND ELECTRONIC COMPONENT ACCOMMODATION BODY PACKAGE
Document Type and Number:
WIPO Patent Application WO/2024/090267
Kind Code:
A1
Abstract:
An electronic component accommodation body (101) is provided with: a bulk case (2) capable of accommodating a plurality of electronic components (3); an RFID tag (20) for identifying the bulk case (2); and an electric conductor (13). The RFID tag (20) has an RFIC and an antenna electrically connected to the RFIC. The electric conductor (13) is capable of displacing with respect to the antenna. Thus, an electronic component accommodation body and an electronic component accommodation body package that are capable of changing a communication distance of an RFID according to a reading purpose can be obtained.
Inventors:
MURAYAMA HIROMI (JP)
YAMADA NOBUTO (JP)
FUKAHORI SOUKO (JP)
IKEDA NAOTO (JP)
YAMADA NOBUTO (JP)
FUKAHORI SOUKO (JP)
IKEDA NAOTO (JP)
Application Number:
PCT/JP2023/037392
Publication Date:
May 02, 2024
Filing Date:
October 16, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
B65D85/86; B65D25/02; G06K19/077
Domestic Patent References:
| WO2022181557A1 | 2022-09-01 | |||
| WO2020079961A1 | 2020-04-23 |
Foreign References:
| JP2022143817A | 2022-10-03 | |||
| JP2022147343A | 2022-10-06 | |||
| JP2011097256A | 2011-05-12 | |||
| JP2005348030A | 2005-12-15 | |||
| US5881782A | 1999-03-16 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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