Title:
ELECTRONIC COMPONENT MOUNTING DEVICE AND ELECTRONIC COMPONENT MOUNTING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/139685
Kind Code:
A1
Abstract:
An electronic component mounting device (1) comprises: an electronic component supply unit (20) that supplies an electronic component having a bump electrode (EB); a transfer stage (31) that accumulates a flux (FX); a mounting stage (41) on which a substrate (BD) is placed; a plurality of heads that can each pick up an electronic component (CP); and a control unit (10) that controls movement of the plurality of heads. The control unit (10) is configured so as to cause each of the plurality of heads to function as a dipping head that dips the bump electrode (EB) of the electronic component (CP) into the flux (FX) accumulated on the transfer stage (31), or as a bonding head that mounts the electronic component (CP) to the substrate (BD) on the mounting stage (41) with the bump electrode (EB) interposed therebetween.
Inventors:
YOSHIDA SHINICHI (JP)
SEYAMA KOHEI (JP)
SEYAMA KOHEI (JP)
Application Number:
PCT/JP2022/001776
Publication Date:
July 27, 2023
Filing Date:
January 19, 2022
Export Citation:
Assignee:
SHINKAWA KK (JP)
International Classes:
H05K13/04; H05K3/34
Foreign References:
| JP2016192468A | 2016-11-10 | |||
| JP2019062199A | 2019-04-18 | |||
| JP2019114819A | 2019-07-11 | |||
| JP2000022394A | 2000-01-21 | |||
| JPH1022347A | 1998-01-23 | |||
| JP2006041462A | 2006-02-09 | |||
| JP2006190864A | 2006-07-20 | |||
| JP2007305726A | 2007-11-22 | |||
| JP2013168456A | 2013-08-29 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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