Title:
ELECTRONIC DEVICE ASSEMBLY APPARATUS AND ELECTRONIC DEVICE ASSEMBLY METHOD
Document Type and Number:
WIPO Patent Application WO/2023/007980
Kind Code:
A1
Abstract:
[Problem] To provide an electronic device assembly apparatus and an electronic device assembly method with which it is possible to reliably carry out an operation for connecting a plurality of types of cables having different width dimensions while correcting warps in the cables. [Solution] This electronic device assembly apparatus 100 comprises a robot control device 114 for controlling the actions of a gripping device 126 for gripping a cable 104, which is flat and flexible and in which a distal end 106 is free, and of a robot arm 124 for causing the gripping device to move relative to a circuit substrate 108 that is the connection destination of the distal end of the cable. The gripping device has a suction unit 141 that is provided to a lower surface 148 and that suctions and retains one surface 112d of the cable, and gripping claws 142, 144 that are positioned on the width-direction outer sides of the suction part and that sandwich and retain the cable in the width direction. First inclined surfaces 152, 170 are formed on the width-direction inner sides of the gripping claws, the first inclined surfaces being inclined such that the gripping width increases upward from the bottoms of the gripping claws. Second inclined surfaces 154, 172 are formed on the bottoms of the gripping claws, the second inclined surfaces being inclined forward and upward while the gripping claws are in a horizontal state.
More Like This:
Inventors:
UCHIJIMA DAISAKU (JP)
SAWATO TERUMASA (JP)
SAWATO TERUMASA (JP)
Application Number:
PCT/JP2022/024320
Publication Date:
February 02, 2023
Filing Date:
June 17, 2022
Export Citation:
Assignee:
NACHI FUJIKOSHI CORP (JP)
International Classes:
B25J15/00; B25J15/06
Domestic Patent References:
| WO2019049639A1 | 2019-03-14 | |||
| WO2017046975A1 | 2017-03-23 |
Foreign References:
| JP2018103334A | 2018-07-05 | |||
| JP2018073721A | 2018-05-10 | |||
| JP2019188534A | 2019-10-31 | |||
| JP2020151790A | 2020-09-24 |
Attorney, Agent or Firm:
HIDA, Kosuke (JP)
Download PDF: