Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/270024
Kind Code:
A1
Abstract:
Provided is an electronic device that makes it possible to suppress a rise in the temperature of an internal electronic component, and to suppress thermal effects on an adjacent electronic device and the like. An electronic device according to the present invention is configured to comprise: a circuit board on which a heat generation element that generates heat is mounted; a housing which accommodates the circuit board; a heat radiation unit which is connected to the housing and which radiates heat; a heat transfer member which is disposed between the heat generation element and the heat radiation unit and which transfers heat generated by the heat generation element to the heat radiation unit; and a housing cover which is disposed on the opposite side to the heat transfer member of the heat radiation unit, wherein a convection area which is an air convection space is disposed between the heat radiation unit and the housing cover.
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Inventors:
YOSHIDA KOUMEI (JP)
HAMAMOTO GORO (JP)
HAMAMOTO GORO (JP)
Application Number:
PCT/JP2022/009602
Publication Date:
December 29, 2022
Filing Date:
March 07, 2022
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
H01L23/467; G06F1/20; H05K7/20
Foreign References:
| JP2020088050A | 2020-06-04 | |||
| JP2016032031A | 2016-03-07 |
Attorney, Agent or Firm:
SHIN-YU INTERNATIONAL PATENT FIRM (JP)
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