Title:
EPOXY RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2007/069525
Kind Code:
A1
Abstract:
Disclosed is an epoxy resin composition for encapsulation containing an epoxy
resin (A) and a curing agent (B). This epoxy resin composition contains a compound
(C) represented by the general formula (I) below, wherein n is an integer of 1-10
and m is an integer of 1-10, as the curing agent (B). The epoxy resin composition
for encapsulation is free from halogens and antimony, while achieving good flame
retardance without deteriorating reliabilities such as moldability, reflow
resistance, moisture resistance and high-temperature shelf characteristics.
Also disclosed is an electronic component device comprising an element encapsulated
with such an epoxy resin composition. (Chemical formula 1) (I) (In the general
formula (I), R1 is selected from a hydrogen atom and substituted or
unsubstituted monovalent hydrocarbon groups having 1-10 carbon atoms, and
R2 is selected from a hydrogen atom and substituted or unsubstituted
monovalent hydrocarbon groups having 1-10 carbon atoms.)
Inventors:
IKEZAWA RYOICHI
AKAGI SEIICHI
AKAGI SEIICHI
Application Number:
PCT/JP2006/324442
Publication Date:
June 21, 2007
Filing Date:
December 07, 2006
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
IKEZAWA RYOICHI
AKAGI SEIICHI
IKEZAWA RYOICHI
AKAGI SEIICHI
International Classes:
C08G59/62; C08G61/02; H01L23/29; H01L23/31
Foreign References:
| JPH08169939A | 1996-07-02 | |||
| JP2000212259A | 2000-08-02 | |||
| JP2002241475A | 2002-08-28 | |||
| JP2005314525A | 2005-11-10 | |||
| JP2001064340A | 2001-03-13 |
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (Toranomon 1-chome Minato-ku, Tokyo01, JP)
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