Title:
HEAT SINK
Document Type and Number:
WIPO Patent Application WO/2011/105364
Kind Code:
A1
Abstract:
Disclosed is a light-weight, low-cost and high-performance heat sink requiring less machining and capable of better heat dissipation performance. The disclosed heat sink is provided with a first heat exchange plate thermally connected on a first surface to a heat generating component and thermally connected to first heat-dissipating thin-plate fins, a second heat exchanger plate thermally connected on a first surface to second heat-dissipating thin-plate fins, a heat pipe thermally connecting a second surface of the first heat exchanger plate and a second surface of the second heat exchanger plate, and a heat exchanger block arranged so as to thermally connect to the side surface and top surface of the heat pipe and so as to hold the heat pipe from either side between said block and the second heat exchange plate.
Inventors:
ITO SHINICHI (JP)
KAWABATA KENYA (JP)
FURUMOTO SHINICHI (JP)
KAWABATA KENYA (JP)
FURUMOTO SHINICHI (JP)
Application Number:
PCT/JP2011/053827
Publication Date:
September 01, 2011
Filing Date:
February 22, 2011
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
ITO SHINICHI (JP)
KAWABATA KENYA (JP)
FURUMOTO SHINICHI (JP)
ITO SHINICHI (JP)
KAWABATA KENYA (JP)
FURUMOTO SHINICHI (JP)
International Classes:
H01L23/427; F28D15/02; H05K7/20
Foreign References:
| JP2006278923A | 2006-10-12 | |||
| JP2007134472A | 2007-05-31 | |||
| JP2009198173A | 2009-09-03 |
Attorney, Agent or Firm:
MATSUSHITA, MAKOTO (JP)
Matsushita δΊ® (JP)
Matsushita δΊ® (JP)
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Claims: