HIGH-FREQUENCY MODULE - MITSUBISHI ELECTRIC CORP

Title:

HIGH-FREQUENCY MODULE

Document Type and Number:

WIPO Patent Application WO/2016/031807

Kind Code:

A1

Abstract:

This high-frequency module (1) is provided with a multilayer-dielectric substrate (2) and a cutoff block (5). The multilayer-dielectric substrate (2) has a ground plane (2a), and a high-frequency electronic component (3) that has a heat-producing part is mounted to the multilayer-dielectric substrate (2) so as to be in contact with said ground plane (2a). The cutoff block (5), which comprises vertical walls (5b) and a cover section (5a) that covers same, contains the high-frequency electronic component (3) and is provided with a cavity (5c) that exhibits cutoff characteristics at the frequency of a high-frequency signal used by the high-frequency electronic component (3). The vertical walls (5b) of the cutoff block (5) are designed so as to contact the ground plane (2a) of the multilayer-dielectric substrate (2). This results in a high-frequency module (1) with improved heat-dissipation performance.

Inventors:

HARAUCHI KENJI (JP)
SAMESHIMA FUMINORI (JP)
NISHIHARA JUN (JP)
TSUYAMA YOSHINORI (JP)

Application Number:

PCT/JP2015/073829

Publication Date:

March 03, 2016

Filing Date:

August 25, 2015

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP (JP)

International Classes:

H01L23/36; H01L23/427; H01L25/00; H05K7/20

Foreign References:

JPH10125830A	1998-05-15
JPH0496295A	1992-03-27
JPH07263887A	1995-10-13
JP2000228452A	2000-08-15
JP2007116217A	2007-05-10
JPH01154607A	1989-06-16

Other References: