Title:
MOUNTING HEAD AND MOUNTING DEVICE IN WHICH SAME IS USED
Document Type and Number:
WIPO Patent Application WO/2016/031806
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a final-compression head, which is a mounting head with which it is possible to reliably absorb variation in the position of a chip component in the pressurization direction and to minimize the deviation in the mounting position between the chip component and a wired substrate while a final-compression attachment is continuously heated; and a mounting device. A final-compression head (17), which is a mounting head for heating and applying pressure to a chip component (D) and connecting the chip component (D) to a predetermined position on a circuit board (C), wherein the final-compression head (17) is provided with: a final-compression attachment (20) that comes into contact with the chip component (D); a final-compression heater block (18) for heating the final-compression attachment (20); a rubber member (20a) that is disposed between the final-compression attachment (20) and the final-compression heater block (18), and is compressed by the final-compression attachment (20) and the final-compression heater block (18) during pressurization; and a spring (19) connected to the final-compression attachment (20) and the final-compression heater block (18), the spring (19) undergoing deformation during pressurization and following the final-compression attachment (20).
Inventors:
ASAHI NOBORU (JP)
MIYAMOTO YOSHINORI (JP)
AOKI SHIMPEI (JP)
NIMURA MASATSUGU (JP)
MIYAMOTO YOSHINORI (JP)
AOKI SHIMPEI (JP)
NIMURA MASATSUGU (JP)
Application Number:
PCT/JP2015/073821
Publication Date:
March 03, 2016
Filing Date:
August 25, 2015
Export Citation:
Assignee:
TORAY ENG CO LTD (JP)
International Classes:
H05K3/34; H01L21/60; H05K13/04
Foreign References:
| JP2009016544A | 2009-01-22 | |||
| JP2010232234A | 2010-10-14 |
Attorney, Agent or Firm:
YANO Juichiro (JP)
Juichiro Yano (JP)
Juichiro Yano (JP)
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