Title:
HIGH-FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2021/033418
Kind Code:
A1
Abstract:
The purpose of the present invention is to reduce the stress applied to an electronic component when mounting a high-frequency module on an outer substrate, while preventing the electronic component from peeling from a mounting substrate. A mounting substrate (2) has one major surface (first major surface 21). An electronic component (3) has a first surface (31), a second surface (32), and a side surface (33), and is provided on the one major surface of the mounting substrate (2). A solder bump (5) is disposed between the mounting substrate (2) and the electronic component (3), and electrically connects the mounting substrate (2) and the electronic component (3) to each other. A resin layer (7) is provided on the one major surface of the mounting substrate (2) so as to cover the electronic component (3). The first surface (31) is a surface of the electronic component (3) opposite the mounting substrate (2). The side surface (33) of the electronic component (3) is in contact with the resin layer (7). In a thickness direction (D1) of the mounting substrate (2), a space (10) is provided between at least a part of the first surface (31) and the resin layer (7).
Inventors:
ONO MAYUKA
TSUDA MOTOJI
HARIMA FUMIO
HIMEDA KOSHI
TOKUYA HIROAKI
TSUDA MOTOJI
HARIMA FUMIO
HIMEDA KOSHI
TOKUYA HIROAKI
Application Number:
PCT/JP2020/024437
Publication Date:
February 25, 2021
Filing Date:
June 22, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/12; H01L23/28; H01L25/065; H01L25/07; H01L25/18; H04B1/38; H05K1/18; H05K3/28
Foreign References:
| JP2010251625A | 2010-11-04 | |||
| JP2010245337A | 2010-10-28 | |||
| JP2019036569A | 2019-03-07 | |||
| JP2018098677A | 2018-06-21 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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