Title:
IMPROVED METHOD FOR MICRO-ROUGHENING TREATMENT OF COPPER AND MIXED-METAL CIRCUITRY
Document Type and Number:
WIPO Patent Application WO2005034596
Kind Code:
B1
Abstract:
Process to improve adhesion of dielectric materials to a metal layer, including providing an unpatterned metal layer having a first major surface; micro-roughening the first major surface to form a micro-roughened surface; and etching the metal layer to form a circuit pattern in the metal layer, in which the micro-roughening is carried out prior to the etching.
Inventors:
FUERHAUPTER HARRY (US)
BARON DAVID THOMAS (GB)
JOHAL KULDIP SINGH (US)
BROOKS PATRICK PAUL (DE)
BARON DAVID THOMAS (GB)
JOHAL KULDIP SINGH (US)
BROOKS PATRICK PAUL (DE)
Application Number:
PCT/US2004/031697
Publication Date:
September 15, 2005
Filing Date:
September 27, 2004
Export Citation:
Assignee:
ATOTECH DEUTSCHLAND GMBH (DE)
FUERHAUPTER HARRY (US)
BARON DAVID THOMAS (GB)
JOHAL KULDIP SINGH (US)
BROOKS PATRICK PAUL (DE)
FUERHAUPTER HARRY (US)
BARON DAVID THOMAS (GB)
JOHAL KULDIP SINGH (US)
BROOKS PATRICK PAUL (DE)
International Classes:
C23F1/18; H05K3/38; H05K3/02; H05K3/06; H05K3/46; (IPC1-7): H05K3/38
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