INK COMPOSITION FOR LIGHT SINTERING, WIRING BOARD USING SAME AND MANUFACTURING METHOD THEREFOR

WIPO Patent Application WO/2015/152625

A1

The present invention relates to an ink composition for light sintering, a wiring board using the same and a manufacturing method therefor, and the purpose thereof is to form a wiring pattern without damage to a thin flexible wiring board such as a flexible printed circuit board. The present invention provides an ink composition for light sintering, comprising: copper oxide nanoparticles having a copper oxide film; a reducing agent for reducing copper oxidized by light radiation to form copper nanoparticles; a dispersing agent; a binder; and a solvent. Also, the present invention provides a method for manufacturing a wiring board and a wiring board manufactured by the manufacturing method, the method comprising the steps of: forming a preliminary wiring pattern by screen-printing an ink composition for light sintering on a flexible substrate body; drying the preliminary wiring pattern; and irradiating the dried preliminary wiring pattern with light so as to reduce and sinter oxidized copper of the copper oxide nanoparticles included in the preliminary wiring pattern, thereby forming a wiring pattern on the substrate body.

KIM YOONJIN (KR)
CHO JINWOO (KR)
SHIN KWONWOO (KR)
SEO YONGGON (KR)
KIM YEONWON (KR)
JANG SANGHYEON (KR)
JO NAMJE (KR)

PCT/KR2015/003226

October 08, 2015

April 01, 2015

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KOREA ELECTRONICS TECHNOLOGY (KR)

C09D11/52; B22F1/0545; B22F1/107; B22F1/16; B22F9/24; H01B1/20; H01B5/14

KR20100050408A	2010-05-13
KR20130077169A	2013-07-09
KR20120132424A	2012-12-05
KR101350507B1	2014-01-17
KR20080004831A	2008-01-10

See also references of EP 3127969A4

PARK, Chonghan (KR)
박종한 (KR)

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