Title:
JOINED BODY AND METHOD OF MANUFACTURING JOINED BODY
Document Type and Number:
WIPO Patent Application WO/2020/121512
Kind Code:
A1
Abstract:
A joined body 1 is provided with a first substrate 10 having a first major surface 10SA, a second substrate 20 having a second major surface 20SA, and a solder 30. The first substrate 10 has a first wire 11 and a first electrode 12. A first surface 12SA of the first electrode 12 includes a first region 12SA1 covering the first major surface 10SA around the first wire 11, and a second region 12SA2 covering the first wire 11. The second region 12SA2 has a greater height than the first region 12SA1 due to a thickness H11 of the first wire 11. The second substrate 20 has a second electrode 22. The solder 30 joins the first electrode 12 and the second electrode 22 together, and is disposed between the first region 12SA1 of the first electrode 12 and a second surface 22SA of the second electrode 22.
Inventors:
KOBAYASHI HIROSHI (JP)
Application Number:
PCT/JP2018/046070
Publication Date:
June 18, 2020
Filing Date:
December 14, 2018
Export Citation:
Assignee:
OLYMPUS CORP (JP)
International Classes:
H01L21/60
Domestic Patent References:
| WO2018092242A1 | 2018-05-24 |
Foreign References:
| JP2010267741A | 2010-11-25 | |||
| JP2005347513A | 2005-12-15 | |||
| JP2014017454A | 2014-01-30 |
Attorney, Agent or Firm:
ITOH Susumu (JP)
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